Asus ROG Strix RTX 3080 10GB

Asus
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  • Aesthetic – A new shroud with metal accents mirrors the design aesthetic of ROG Strix motherboards. The side is lit with an addressable RGB strip that can be customized with Armoury Crate to sync up with other ROG products to create a uniform aesthetic.
  • Engineering – Top-shelf capacitors, chokes, and MOSFETs are selected to effortlessly deliver hundreds of watts at a millisecond’s notice. Dubbed Super Alloy Power II, these components are soldered to the PCB using an Auto-Extreme automated manufacturing process, ensuring accurate placement and a perfect joint every time.
  • Cooling – A MaxContact heat spreader efficiently transfers heat into a new heatsink that spans most of the card’s 2.9-slot footprint. On top, three optimized Axial-tech fans work in tandem to drive air through the entire array, helping to keep temperatures under tight control.
  • Software – Hardware and software come together to let gamers fully customize and control their gaming experience. GPU Tweak II enables tweaks and monitoring, XSplit offers a robust streaming solution, and wtfast can improve routing to game servers for a more stable gaming connection.

155,000

Out of stock

AXIAL-TECH UPGRADES

Our Axial-tech fan design has been optimized for a new, larger heatsink that features more fins and surface area than last gen. The blade count has been increased on all three fans, with 13 on the center fan and 11 on the auxiliary fans. The barrier ring on the side fans has been slimmed down to allow for more lateral intake and to provide better airflow through the cooling array. The center fan’s extra blades and full-height ring provide boosted static pressure to blast air directly onto the GPU heat spreader.

MAXCONTACT

To get heat up off the die and into the heatsink array to benefit from the new fan design requires special attention. We use a manufacturing process that polishes the surface of the heat spreader to improve smoothness at the microscopic level. The extra flatness allows for better contact with the die for improved thermal transfer.

2.9-SLOT DESIGN

The heat spreader draws heat up into heatpipes that carry it through a fin stack that fills a large 2.9-slot footprint. Increasing the heatsink size compared to the last generation provides more thermal headroom to account for the new high-performance chipset.

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